Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
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Application No.: US17867640Application Date: 2022-07-18
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Publication No.: US12224335B2Publication Date: 2025-02-11
- Inventor: Ching-Chung Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202210696460.7 20220620
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/265 ; H01L21/266 ; H01L29/78

Abstract:
A semiconductor device includes a substrate of first conductivity type; a first heavily doped region and a second heavily doped region of second conductivity type spaced apart from the first heavily doped region, located in the substrate; a channel region in the substrate and between the first heavily doped region and the second heavily doped region; a gate disposed on the channel region; a hard mask layer covering a top surface and a sidewall of the gate; and a spacer disposed on a sidewall of the hard mask layer.
Public/Granted literature
- US20230411495A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2023-12-21
Information query
IPC分类: