Invention Grant
- Patent Title: High frequency assembly
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Application No.: US17775961Application Date: 2020-11-17
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Publication No.: US12224476B2Publication Date: 2025-02-11
- Inventor: Ulf Hügel
- Applicant: HUBER+SUHNER AG
- Applicant Address: CH Herisau
- Assignee: HUBER+SUHNER AG
- Current Assignee: HUBER+SUHNER AG
- Current Assignee Address: CH Herisau
- Agency: Pauley Erickson & Swanson
- Priority: CH01470/19 20191121
- International Application: PCT/EP2020/082360 WO 20201117
- International Announcement: WO2021/099300 WO 20210527
- Main IPC: H01P3/16
- IPC: H01P3/16 ; H01P1/161 ; H04B10/2507

Abstract:
A high-frequency assembly includes a cable with at least one dielectric waveguide fiber with a first end and an opposed second end. The high-frequency assembly includes a high-frequency circuit and an interface unit. The at least one dielectric waveguide fiber is at the first end operatively coupled with the high-frequency circuit via the interface unit. The interface unit is designed to inject a high-frequency signal into the dielectric waveguide fiber and/or to receive a high-frequency signal from the at least one dielectric waveguide fiber at the first end. The high-frequency signal has a first signal component of a first polarization direction and a second signal component of a second polarization direction, wherein the high-frequency assembly is designed to inject the first signal component and the second signal component in a defined manner and/or to split a received high-frequency signal into the first signal component and the second signal component.
Public/Granted literature
- US20220393331A1 HIGH FREQUENCY ASSEMBLY Public/Granted day:2022-12-08
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