Invention Grant
- Patent Title: Optical module
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Application No.: US17592606Application Date: 2022-02-04
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Publication No.: US12224552B2Publication Date: 2025-02-11
- Inventor: Daisuke Noguchi , Hiroshi Yamamoto
- Applicant: CIG Photonics Japan Limited
- Applicant Address: JP Kanagawa
- Assignee: CIG Photonics Japan Limited
- Current Assignee: CIG Photonics Japan Limited
- Current Assignee Address: JP Kanagawa
- Agency: MATTINGLY & MALUR, PC
- Priority: JP2021-031654 20210301
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/02212 ; H01S5/0231 ; H01S5/02315 ; H01S5/02345 ; H01S5/0239 ; H01S5/062 ; H01S5/024 ; H01S5/026 ; H01S5/042

Abstract:
An optical module includes: amounting substrate; a support block on which the mounting substrate is mounted; and a stem having a support surface to support the support block, the stem having a pedestal portion with a tip face in a protruding direction and with an upper surface spreading along the protruding direction; a relay board on the upper surface; a connection block fixed to the tip face; and wires connecting the support block and the mounting substrate to the connection block. The connection block has a surface made of a conductor. The connection block has a first bonding surface facing the same direction as the tip face of the pedestal portion and a second bonding surface facing the same direction as the upper surface. The wires include first and second wires having their ends bonded to the first and second bonding surface, respectively.
Public/Granted literature
- US20220278500A1 OPTICAL MODULE Public/Granted day:2022-09-01
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