An image sensor may be implemented by mounting a first die to a second die. The first die may include an image sensor pixel array having active pixels and non-active pixels, while the second die may include pixel control and readout circuitry that are coupled to the image sensor pixel array via inter-die connections. The image sensor pixel array may have pixel columns in excess of corresponding column readout paths in the pixel readout circuitry and/or pixel rows in excess of corresponding sets of row control paths in the pixel control circuitry. A select set of inter-die connections may be implemented to provide connections between a desired set of pixel columns and the limited number of column readout paths and to provide connections between a desired set of pixel rows and the limited number of sets of row control paths.