Invention Grant
- Patent Title: Circuit board assembly
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Application No.: US17747349Application Date: 2022-05-18
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Publication No.: US12225664B2Publication Date: 2025-02-11
- Inventor: Daisuke Dobashi , Takeshi Kimura
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kawasaki
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kawasaki
- Priority: JP2021-084915 20210519
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/02

Abstract:
A circuit board assembly includes a first circuit board, a second circuit board having a first side extending adjacent to a first side of the first circuit board, and a metal fitting including a portion bent at the angle and spanning both the first side of the first circuit board and the first side of the second circuit board. The second circuit board is in a posture having an angle other than 180° to the first circuit board. The metal fitting is fixed to both the first circuit board and the second circuit board.
Public/Granted literature
- US20220377891A1 Circuit Board Assembly Public/Granted day:2022-11-24
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