Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US18136418Application Date: 2023-04-19
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Publication No.: US12230445B2Publication Date: 2025-02-18
- Inventor: Bon Hyeong Koo , Seok Hyun Yoon , In Ho Jeon , Byung Kil Yun , Se Yong Kim , Min Jung Jang , Geon Hoi Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2023-0003409 20230110
- Main IPC: H01G4/12
- IPC: H01G4/12 ; C04B35/626 ; H01G4/008 ; H01G4/012 ; H01G4/30

Abstract:
A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.
Public/Granted literature
- US20240234032A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2024-07-11
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