Invention Grant
- Patent Title: Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof
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Application No.: US17459509Application Date: 2021-08-27
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Publication No.: US12230532B2Publication Date: 2025-02-18
- Inventor: Yun Chen Teng , Chen-Fong Tsai , Han-De Chen , Jyh-Cherng Sheu , Huicheng Chang , Yee-Chia Yeo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/67 ; H01L27/12 ; H01L29/06 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/786
Abstract:
A method of forming a semiconductor device includes loading a first wafer and a second wafer into a wafer bonding system. A relative humidity within the wafer bonding system is measured a first time. After measuring the relative humidity, the relative humidity within the wafer bonding system may be adjusted to be within a desired range. When the relative humidity is within the desired range, the first wafer is bonded to the second wafer.
Public/Granted literature
- US20230063975A1 Semiconductor Device, Method of Manufacture, and System of Manufacture Public/Granted day:2023-03-02
Information query
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