Invention Grant
- Patent Title: Three-dimensional pad structure and interconnection structure for electronic devices
-
Application No.: US17691056Application Date: 2022-03-09
-
Publication No.: US12230562B2Publication Date: 2025-02-18
- Inventor: Chin-Chiang Chang
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31
Abstract:
A three-dimensional pad structure includes a substrate; a pad disposed on the substrate, wherein a perimeter of the pad is covered with a solder mask; and at least one conductive pillar protruding from a top surface of the pad.
Public/Granted literature
- US20220328394A1 THREE-DIMENSIONAL PAD STRUCTURE AND INTERCONNECTION STRUCTURE FOR ELECTRONIC DEVICES Public/Granted day:2022-10-13
Information query
IPC分类:
