Invention Grant
- Patent Title: Package comprising stacked integrated devices with overhang
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Application No.: US17375931Application Date: 2021-07-14
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Publication No.: US12230604B2Publication Date: 2025-02-18
- Inventor: Krishna Vemuri , Jinseong Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00
Abstract:
A package that includes a substrate, a first integrated device coupled to the substrate, and a second integrated device coupled to the first integrated device. A portion of the second integrated device overhangs over the first integrated device. The second integrated device is configured to be coupled to the substrate. The second integrated device includes a front side and a back side. The front side of the second integrated device faces the substrate.
Public/Granted literature
- US20230019333A1 PACKAGE COMPRISING STACKED INTEGRATED DEVICES WITH OVERHANG Public/Granted day:2023-01-19
Information query
IPC分类:
