Invention Grant
- Patent Title: Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
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Application No.: US17555015Application Date: 2021-12-17
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Publication No.: US12230614B2Publication Date: 2025-02-18
- Inventor: Marvin Marbell , Haedong Jang , Jeremy Fisher , Basim Noori
- Applicant: WOLFSPEED, INC.
- Applicant Address: US NC Durham
- Assignee: WOLFSPEED, INC.
- Current Assignee: WOLFSPEED, INC.
- Current Assignee Address: US NC Durham
- Agency: BakerHostetler
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/00
Abstract:
A transistor device includes a metal submount; a transistor die arranged on said metal submount; a first integrated passive device (IPD) component that includes a first substrate arranged on said metal submount; and a second integrated passive device (IPD) component that includes a second substrate arranged on the metal submount. Additionally, the first substrate is a different material from the second substrate.
Public/Granted literature
- US20230197698A1 MULTI-TYPED INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND DEVICES AND PROCESSES IMPLEMENTING THE SAME Public/Granted day:2023-06-22
Information query
IPC分类:
