Invention Grant
- Patent Title: Semiconductor device structure and methods of forming the same
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Application No.: US17410048Application Date: 2021-08-24
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Publication No.: US12230713B2Publication Date: 2025-02-18
- Inventor: Chia-Wei Chen , Chi-Sheng Lai , Shih-Hao Lin , Jian-Hao Chen , Kuo-Feng Yu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: NZ CARR LAW OFFICE
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/324 ; H01L21/8234 ; H01L29/08 ; H01L29/417 ; H01L29/423 ; H01L29/51 ; H01L29/66 ; H01L29/775 ; H01L29/78 ; H01L29/786

Abstract:
A transistor is provided. The transistor includes a first source/drain epitaxial feature, a second source/drain epitaxial feature, and two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature. The two or more semiconductor layers comprise different materials. The transistor further includes a gate electrode layer surrounding at least a portion of the two or more semiconductor layers, wherein the transistor has two or more threshold voltages.
Public/Granted literature
- US20220320337A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2022-10-06
Information query
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