Invention Grant
- Patent Title: Self-aligned gate endcap (SAGE) architectures with vertical sidewalls
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Application No.: US18622615Application Date: 2024-03-29
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Publication No.: US12230714B2Publication Date: 2025-02-18
- Inventor: Ritesh K. Das , Kiran Chikkadi , Ryan Pearce
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/49 ; H01L21/02

Abstract:
Self-aligned gate endcap (SAGE) architectures with vertical sidewalls, and methods of fabricating self-aligned gate endcap (SAGE) architectures with vertical sidewalls, are described. In an example, an integrated circuit structure includes a semiconductor fin having sidewalls along a length of the semiconductor fin, each sidewall tapering outwardly from a top of the semiconductor fin toward a bottom of the semiconductor fin. A gate endcap isolation structure is spaced apart from the semiconductor fin and has a length parallel with the length of the semiconductor fin. The gate endcap isolation structure has a substantially vertical sidewall laterally facing one of the outwardly tapering sidewalls of the semiconductor fin.
Public/Granted literature
- US20240243202A1 SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH VERTICAL SIDEWALLS Public/Granted day:2024-07-18
Information query
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