Invention Grant
- Patent Title: High speed connector with moldable conductors
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Application No.: US17652179Application Date: 2022-02-23
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Publication No.: US12230923B2Publication Date: 2025-02-18
- Inventor: John Joseph Consoli , Chad William Morgan , Timothy Robert Minnick , David Wayne Helster , Ting Gao , Jialing Wang , Mark Wartenberg
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Services GmbH
- Current Assignee: TE Connectivity Services GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H01R13/6585
- IPC: H01R13/6585
Abstract:
An electrical connector including a housing defining an interior cavity and extending from a mounting end to an engagement end, and at least one signal component disposed within the interior cavity of the housing. The housing is formed from a conductive composite material and engages the at least one signal component to shield the interior cavity.
Public/Granted literature
- US20220181824A1 HIGH SPEED CONNECTOR WITH MOLDABLE CONDUCTORS Public/Granted day:2022-06-09
Information query
