Invention Grant
- Patent Title: Printed wiring board
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Application No.: US18007590Application Date: 2021-03-29
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Publication No.: US12232261B2Publication Date: 2025-02-18
- Inventor: Kou Noguchi , Masaki Miyabara
- Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Koka; JP Osaka
- Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Koka; JP Osaka
- Agency: Oliff PLC
- Priority: JP2020-097435 20200604
- International Application: PCT/JP2021/013296 WO 20210329
- International Announcement: WO2021/246033 WO 20211209
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed wiring board includes: a board having a through-hole; a land portion that is disposed on an inner circumferential surface of the through-hole and on a surface of the board at a circumferential edge of the through-hole, and that has a through-hole conductor portion; and a wire that is disposed on the surface of the board and that has one longitudinal end portion electrically connected to the land portion, a maximum length of a connection portion between the wire and the land portion being greater than or equal to a sum of a maximum diameter of the through-hole and a minimum line width of the wire.
Public/Granted literature
- US20230199960A1 PRINTED WIRING BOARD Public/Granted day:2023-06-22
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