Invention Grant
- Patent Title: Electronic device including housing
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Application No.: US17682158Application Date: 2022-02-28
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Publication No.: US12232287B2Publication Date: 2025-02-18
- Inventor: Kidoc Son , Youngchun Kim , Byounggyu Park , Kyunghwan Song , Hyuckki Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2021-0080906 20210622
- Main IPC: H05K5/00
- IPC: H05K5/00 ; B23H3/00 ; C25D11/26 ; C25D11/34 ; G06F1/16 ; H05K5/04

Abstract:
According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.
Public/Granted literature
- US20220408582A1 ELECTRONIC DEVICE INCLUDING HOUSING Public/Granted day:2022-12-22
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