Invention Grant
- Patent Title: Nonvolatile memory device
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Application No.: US17726899Application Date: 2022-04-22
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Publication No.: US12232318B2Publication Date: 2025-02-18
- Inventor: Jae Ho Ahn , Sung-Min Hwang , Joon-Sung Lim , Bum Kyu Kang , Sang Don Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0127725 20191015
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B43/10 ; H10B43/35

Abstract:
A nonvolatile memory device including a mold structure including a plurality of gate electrodes on a substrate, the plurality of gate electrodes including first, second, and third string selection lines sequentially stacked on the substrate; a channel structure that penetrates the mold structure and intersects each of the gate electrodes; a first cutting region that cuts each of the gate electrodes; a second cutting region that is spaced apart from the first cutting region in a first direction and cuts each of the gate electrodes; a first cutting line that cuts the first string selection line between the first cutting region and the second cutting region; a second cutting line that cuts the second string selection line between the first cutting region and the second cutting region; and a third cutting line that cuts the third string selection line between the first cutting region and the second cutting region.
Public/Granted literature
- US20220246643A1 NONVOLATILE MEMORY DEVICE Public/Granted day:2022-08-04
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