Invention Grant
- Patent Title: Source/drain feature for multigate device performance and method of fabricating thereof
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Application No.: US17552111Application Date: 2021-12-15
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Publication No.: US12243912B2Publication Date: 2025-03-04
- Inventor: Chih-Chuan Yang , Wen-Chun Keng , Chong-De Lien , Shih-Hao Lin , Hsin-Wen Su , Ping-Wei Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/764 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
Semiconductor devices having improved source/drain features and methods for fabricating such are disclosed herein. An exemplary device includes a semiconductor layer stack disposed over a mesa structure of a substrate. The device further includes a metal gate disposed over the semiconductor layer stack and an inner spacer disposed on the mesa structure of the substrate. The device further includes a first epitaxial source/drain feature and a second epitaxial source/drain feature where the semiconductor layer stack is disposed between the first epitaxial source/drain feature and the second epitaxial source/drain feature. The device further includes a void disposed between the inner spacer and the first epitaxial source/drain feature.
Public/Granted literature
- US20220367620A1 Source/Drain Feature for Multigate Device Performance and Method of Fabricating Thereof Public/Granted day:2022-11-17
Information query
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