An antenna package according to an exemplary embodiment includes an antenna unit, a printed circuit board including an antenna connection wiring electrically connected to the antenna unit, an antenna driving integrated circuit (IC) chip mounted on the printed circuit board and connected to the antenna connection wiring, and a touch sensor driving IC chip and a display driving IC chip mounted on the printed circuit board together with the antenna driving IC chip. The driving IC chips are integrated in a single printed circuit board to improve spatial and process efficiency.