Invention Grant
- Patent Title: Wiring board and electronic device
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Application No.: US17992078Application Date: 2022-11-22
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Publication No.: US12245364B2Publication Date: 2025-03-04
- Inventor: Tatsuaki Denda , Takehito Terasawa
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2021-190262 20211124
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03

Abstract:
A wiring board includes a plurality of insulating layers each being made of flexible insulating resin, and a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern. The conductor layer includes a conductor pattern that has a certain shape in which a plurality of unit patterns are connected in plan view. The unit pattern includes a U-shaped pattern, an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern, and a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern.
Public/Granted literature
- US20230164908A1 WIRING BOARD AND ELECTRONIC DEVICE Public/Granted day:2023-05-25
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