A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.