In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.