Apparatus for flattening a warped ball grid array (BGA) package, including a first plate having a first surface and opposite second surface and a second plate having a first surface and opposite second surface. The first surface of the first plate and the first surface of the second plate oppose each other with a gap there-between. The gap houses the warped BGA package there-in, the warped BGA package including a package substrate with solder balls attached to a device mounting surface of the package substrate to form a BGA thereon. The gap adjustable by changing the position of the first plate or of the second plate such that a pushing force is applicable to the warped BGA package. A method of manufacturing a flattened BGA package and computer having a circuit that include the flatted BGA package are also disclosed.