Invention Grant
- Patent Title: Vertical-conduction silicon carbide MOSFET device having improved gate biasing structure and manufacturing process thereof
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Application No.: US17669239Application Date: 2022-02-10
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Publication No.: US12249634B2Publication Date: 2025-03-11
- Inventor: Mario Giuseppe Saggio , Alfio Guarnera , Cateno Marco Camalleri
- Applicant: STMICROELECTRONICS S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: SEED IP LAW GROUP LLP
- Priority: IT102021000003653 20210217
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/16 ; H01L29/40 ; H01L29/43 ; H01L29/66 ; H01L29/78

Abstract:
A vertical-conduction MOSFET device formed in a body of silicon carbide having a first and a second face and a peripheral zone. A drain region, of a first conductivity type, extends in the body between the two faces. A body region, of a second conductivity type, extends in the body from the first face, and a source region, having the first conductivity type, extends to the inside of the body region from the first face of the body. An insulated gate region extends on the first face of the body and comprises a gate conductive region. An annular connection region, of conductive material, is formed within a surface edge structure extending on the first face of the body, in the peripheral zone. The gate conductive region and the annular connection region are formed by a silicon layer and by a metal silicide layer overlying the silicon layer.
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