A communication device is provided. The communication device includes a heat dissipation case, a heat conductive member, a heat dissipation base, and a communication module. The heat conductive member is thermally connected to the heat dissipation case, and the heat dissipation base is pivotally connected to the heat conductive member. The heat dissipation base is thermally connected to the heat conductive member and is adapted to be rotated between a first orientation and a second orientation relative to the heat conductive member. The communication module is affixed to the heat dissipation base.