Invention Grant
- Patent Title: Semiconductor module
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Application No.: US18026006Application Date: 2021-09-09
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Publication No.: US12249904B2Publication Date: 2025-03-11
- Inventor: Hideo Hara , Naohiro Imakake
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2020-168742 20201005
- International Application: PCT/JP2021/033082 WO 20210909
- International Announcement: WO2022/075000 WO 20220414
- Main IPC: H02M1/088
- IPC: H02M1/088 ; H02M7/537 ; H02P27/06

Abstract:
A semiconductor module includes a first terminal configured to be fed with a first potential, a second terminal, a third terminal configured to be fed with a second potential lower than the first potential, a first switch connected between the first and second terminals, a second switch connected between the second and third terminals, a first driver configured to turn on and off the first switch, and a second driver configured to turn on and off the second switch. The first driver is configured to set, based on a voltage fed to the second terminal, an inhibition period in which the first switch is inhibited from being turned on.
Public/Granted literature
- US20230369961A1 SEMICONDUCTOR MODULE Public/Granted day:2023-11-16
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