Invention Grant
- Patent Title: Electronic device including heat dissipation sheet
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Application No.: US17975169Application Date: 2022-10-27
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Publication No.: US12250798B2Publication Date: 2025-03-11
- Inventor: Haein Chung , Kyungha Koo , Kangsik Kim , Wonmin Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2020-0052299 20200429
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F16F15/04 ; H04M1/02

Abstract:
An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.
Public/Granted literature
- US20230039881A1 ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION SHEET Public/Granted day:2023-02-09
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