Invention Grant
- Patent Title: Radiation shield with zipper
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Application No.: US17482244Application Date: 2021-09-22
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Publication No.: US12250800B2Publication Date: 2025-03-11
- Inventor: Yew San Lim , Jeff Ku , Boon Ping Koh , Min Suet Lim , Tin Poay Chuah
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Banner & Witcoff Ltd.
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K7/20

Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.
Public/Granted literature
- US20220015272A1 RADIATION SHIELD WITH ZIPPER Public/Granted day:2022-01-13
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