Invention Grant
- Patent Title: Memory structure and memory device
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Application No.: US17908477Application Date: 2022-05-12
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Publication No.: US12254939B2Publication Date: 2025-03-18
- Inventor: Weibing Shang , Hongwen Li
- Applicant: ChangXin Memory Technologies, Inc.
- Applicant Address: CN Hefei
- Assignee: ChangXin Memory Technologies, Inc.
- Current Assignee: ChangXin Memory Technologies, Inc.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN202111270751.1 20211029
- International Application: PCT/CN2022/092551 WO 20220512
- International Announcement: WO2023/071144 WO 20230504
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C29/44

Abstract:
A memory structure of an integrated circuit includes a plurality of memory arrays arranged in parallel along the first direction and extending along the second direction, a sensitivity amplifier array extending along the second direction is arranged between every two memory arrays, and the sensitivity amplifier array includes an odd-numbered sensitivity amplifier array and an even-numbered sensitivity amplifier array, the odd-numbered sensitivity amplifier array is connected to an odd-numbered global signal line, and the even-numbered sensitivity amplifier array is connected to the even-numbered global signal line; a first sensitivity amplifier array is arranged between the memory arrays at the edge, and the first sensitivity amplifier array is connected to both the odd-numbered global signal line and the even-numbered global signal line. The present disclosure can improve reliability, yield and test success rate of the memory products.
Public/Granted literature
- US20240194286A1 Memory Structure and Memory Device Public/Granted day:2024-06-13
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