Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17502615Application Date: 2021-10-15
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Publication No.: US12255092B2Publication Date: 2025-03-18
- Inventor: Junnosuke Taguchi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP2020-180260 20201028
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/687

Abstract:
A substrate processing apparatus includes: a rotary table provided inside a processing container; a stage provided on an upper surface of the rotary table in order to mount a substrate thereon, and configured to revolve by a rotation of the rotary table; a heater configured to heat the substrate mounted on the stage; and a rotation shaft provided at a location that rotates together with the rotary table to freely rotate while supporting the stage, and including a low heat conductivity body formed of a material with a heat conductivity lower than that of the stage.
Public/Granted literature
- US20220130712A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-04-28
Information query
IPC分类: