Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US17689800Application Date: 2022-03-08
-
Publication No.: US12255250B2Publication Date: 2025-03-18
- Inventor: Shoko Hanagata
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2021-152087 20210917
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/861

Abstract:
A semiconductor device includes: a first electrode; a first semiconductor layer on the first electrode in a diode region; a second semiconductor layer on the first electrode in an IGBT region; a semiconductor layer on the first and second semiconductor layers, a first upper layer of the semiconductor layer in the diode region including a first region adjacent to the IGBT region and a second region separated from the IGBT region, an impurity concentration being less in the first region than in the second region; a third semiconductor layer on the semiconductor layer; a fourth semiconductor layer of the third semiconductor layer in the IGBT region; a third electrode extending in a direction from the fourth semiconductor layer toward the semiconductor layer; and an insulating film between the second electrode and each of the third semiconductor layer, the semiconductor layer, and the third electrode.
Public/Granted literature
- US20230090885A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-03-23
Information query
IPC分类: