Invention Grant
- Patent Title: Semiconductor device and fabrication method
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Application No.: US18513624Application Date: 2023-11-19
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Publication No.: US12266532B2Publication Date: 2025-04-01
- Inventor: Yasunori Agata , Takahiro Tamura , Toru Ajiki
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2018-215548 20181116
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/22 ; H01L21/265 ; H01L27/06 ; H01L29/32 ; H01L29/36 ; H01L29/739 ; H01L29/861

Abstract:
A semiconductor device comprising a semiconductor substrate having upper and lower surfaces and a hydrogen containing region containing hydrogen and a lifetime control region is provided. The carrier concentration distribution of the hydrogen containing region has: a first local maximum point; a second local maximum point closest to the first local maximum point among local maximum points positioned between the first local maximum point and the upper surface; a first intermediate point of the local minimum between the first and second local maximum points; and a second intermediate point closest to the second local maximum point among local minimum points or flat points where the carrier concentration remains constant positioned between the second local maximum point and the upper surface. The lifetime control region is positioned at least between the first and second local maximum points. The first intermediate point has a lower carrier concentration than the second intermediate point.
Public/Granted literature
- US20240096629A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD Public/Granted day:2024-03-21
Information query
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