Invention Grant
- Patent Title: Multiple process semiconductor processing system
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Application No.: US16932795Application Date: 2020-07-19
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Publication No.: US12266550B2Publication Date: 2025-04-01
- Inventor: Nitin Pathak , Vinay K. Prabhakar , Badri N. Ramamurthi , Viren Kalsekar , Juan Carlos Rocha-Alvarez
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; H01L21/677

Abstract:
Exemplary substrate processing systems may include a plurality of processing regions. The systems may include a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions. The systems may include a plurality of substrate supports. Each substrate support of the plurality of substrate supports may be vertically translatable between the transfer region and an associated processing region of the plurality of processing regions. The systems may include a transfer apparatus including a rotatable shaft extending through the transfer region housing. The transfer apparatus may also include an end effector coupled with the rotatable shaft. The systems may include an exhaust foreline including a plurality of foreline tails. Each foreline tail of the plurality of foreline tails may be fluidly coupled with a separate processing region of the plurality of processing regions. The systems may include a plurality of throttle valves.
Public/Granted literature
- US20220020615A1 MULTIPLE PROCESS SEMICONDUCTOR PROCESSING SYSTEM Public/Granted day:2022-01-20
Information query
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