Devices and methods that result in very low stress circuit die attachment to substrates such as PCB's and flex circuits are described. Stress, due to thermal expansion mismatches, is reduced by reducing the amount of die bonding area that is covered by adhesive material. In some instances, the area left uncovered by adhesive material may be all or partially filled with a low viscosity material that may also be thermally conductive, such as thermal grease. Reducing the contact area between the die and inherently low elasticity adhesives reduces the mechanical effect of thermal mismatches between the die and the substrate. The provided techniques are particularly beneficial when used to bond uncooled thermal imaging FPA dies to substrates.