Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US18508231Application Date: 2023-11-14
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Publication No.: US12266711B2Publication Date: 2025-04-01
- Inventor: Beom-Yong Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T GROUP LLP
- Priority: KR10-2018-0081861 20180713
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L21/28 ; H01L29/06 ; H01L29/49 ; H01L29/94 ; H01L49/02 ; H10B12/00

Abstract:
A semiconductor layer stack includes a first conductive layer, a dielectric layer including a high-k material, which is formed on the first conductive layer, a second conductive layer formed on the dielectric layer, and an interface control layer formed between the dielectric layer and the second conductive layer and including a leakage blocking material, a dopant material, a high bandgap material and a high work function material.
Public/Granted literature
- US20240088257A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2024-03-14
Information query
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