A self-cooling chassis for a communication device. The chassis includes a top housing including a first set of input/output (I/O) connectors arranged along a top housing front side. The top housing is configured to house at least one processor communicatively coupled to the first set of I/O connectors. The top housing has a top side including a plurality of heat fins configured to dissipate heat away from the at least one processor. The top housing has a top housing aperture. The chassis includes a bottom housing including a second set of I/O connectors arranged along a bottom housing front side. The bottom housing houses a I/O circuitry. The I/O circuitry communicatively couples the second set of I/O connectors to at least one processor. The bottom housing has a bottom housing aperture. The chassis includes a guide pin configured to be inserted into a top housing aperture and a bottom housing aperture. The top housing and the bottom housing are configured to connect by aligning the top housing front side with the bottom housing front side and by aligning the guide pin into the top housing aperture and the bottom housing aperture.