• Patent Title: Composite substrates for saw tags or RFID and sensors applications
  • Application No.: US16980324
    Application Date: 2019-03-14
  • Publication No.: US12271774B2
    Publication Date: 2025-04-08
  • Inventor: Sylvain BallandrasThierry LaRoche
  • Applicant: Soitec
  • Applicant Address: FR Bernin
  • Assignee: Soitec
  • Current Assignee: Soitec
  • Current Assignee Address: FR Bernin
  • Agency: TraskBritt
  • International Application: PCT/EP2019/056428 WO 20190314
  • International Announcement: WO2019/175315 WO 20190919
  • Main IPC: H03H9/02
  • IPC: H03H9/02 G06K19/067 H03H3/08 H03H9/25
Composite substrates for saw tags or RFID and sensors applications
Abstract:
A surface acoustic wave tag device is disclosed, comprising: an acoustic wave propagating substrate, at least one transducer structure comprising inter-digitated comb electrodes, and at least one reflecting means, the reflecting means comprising at least one reflector, wherein the acoustic wave propagation substrate is a composite substrate comprising a base substrate and a piezoelectric layer, wherein the crystallographic orientation of the piezoelectric layer with respect to the base substrate is such that the propagation of a shear wave inside the piezoelectric layer and in the direction of propagation corresponding to the acoustic wave is enabled. A physical quantity determining device and a fabrication method of such surface acoustic wave tag device are also disclosed.
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