Invention Grant
- Patent Title: Electronic device
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Application No.: US17255954Application Date: 2018-06-29
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Publication No.: US12272489B2Publication Date: 2025-04-08
- Inventor: Kosuke Ikeda , Yoshiaki Hiruma
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2018/024765 WO 20180629
- International Announcement: WO2020/003482 WO 20200102
- Main IPC: H01F27/32
- IPC: H01F27/32

Abstract:
An electronic device has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a coil sealing part 50 sealing the primary coil 10 and the secondary coil 20 and being made of sealing resin; a primary-side electronic element 110 electrically connected to the primary coil 10; and a secondary-side electronic element 210 electrically connected to the secondary coil 20. The primary-side electronic element 110 is provided on a primary-side extension part 60 extending from the primary coil 10 to an outside of the coil sealing part 50, or the secondary-side electronic element 210 is provided on a secondary-side extension part 70 extending from the secondary coil 20 to an outside of the coil sealing part 50.
Public/Granted literature
- US20210272748A1 ELECTRONIC DEVICE Public/Granted day:2021-09-02
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