Invention Grant
- Patent Title: Memory devices having vertical transistors and stacked storage units and methods for forming the same
-
Application No.: US17539818Application Date: 2021-12-01
-
Publication No.: US12274049B2Publication Date: 2025-04-08
- Inventor: Dongxue Zhao , Tao Yang , Zhiliang Xia , Zongliang Huo
- Applicant: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Current Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Wuhan
- Agency: BAYES PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/00 ; H01L25/00 ; H01L25/065 ; H01L25/18 ; H01L29/78 ; H10B12/00

Abstract:
In certain aspects, a memory device includes a vertical transistor including a semiconductor body extending in a first direction, a stack structure including interleaved dielectric layers and conductive layers each extending perpendicularly to the first direction, an electrode layer including a conductive material and coupled to a first end of the semiconductor body, and a storage layer over the electrode layer. The electrode layer and the storage layer extend in the first direction through the stack structure.
Public/Granted literature
- US20230132574A1 MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND STACKED STORAGE UNITS AND METHODS FOR FORMING THE SAME Public/Granted day:2023-05-04
Information query
IPC分类: