Invention Grant
- Patent Title: Semiconductor device having ferroelectric layer in recess and method for manufacturing the same
-
Application No.: US17783627Application Date: 2021-12-23
-
Publication No.: US12274069B2Publication Date: 2025-04-08
- Inventor: Weixing Huang , Huilong Zhu
- Applicant: BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY , INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing; CN Beijing
- Assignee: BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY,INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY,INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN202111535097.2 20211215
- International Application: PCT/CN2021/140813 WO 20211223
- International Announcement: WO2023/108785 WO 20230622
- Main IPC: H10B51/30
- IPC: H10B51/30 ; H10B51/10 ; H10B51/20

Abstract:
A semiconductor device, including a substrate, a first electrode layer, a functional layer, and a second electrode layer. The functional layer is located between the first electrode layer and the second electrode layer, and includes a first region and a second region having a C-shaped structure surrounding the first region. The C-shape structure opens toward a direction that is parallel with the substrate and away from the first region, that is, the C-shaped structure opens toward a distal side. The first region is made of at least germanium, and the second region includes a C-shaped ferroelectric layer and a C-shaped gate that are sequentially stacked. The C-shaped ferroelectric layer serves as a memory layer of the memory device.
Public/Granted literature
- US20240164110A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2024-05-16
Information query