Invention Grant
- Patent Title: Temperature adjustment device
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Application No.: US18289190Application Date: 2022-04-12
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Publication No.: US12276990B2Publication Date: 2025-04-15
- Inventor: Tetsuya Nishimura , Masayuki Numata
- Applicant: NIPPON THERMOSTAT CO., LTD.
- Applicant Address: JP Kiyose
- Assignee: NIPPON THERMOSTAT CO., LTD.
- Current Assignee: NIPPON THERMOSTAT CO., LTD.
- Current Assignee Address: JP Kiyose
- Agency: HAUPTMAN HAM, LLP
- Priority: JP2021-082649 20210514
- International Application: PCT/JP2022/017598 WO 20220412
- International Announcement: WO2022/239592 WO 20221117
- Main IPC: G05D23/02
- IPC: G05D23/02 ; F01P7/14 ; F01P7/16

Abstract:
A temperature adjustment device is capable of suppressing sleeve enlargement and preventing the rattling thereof with a synthetic resin housing. Flanges are formed on the temperature adjustment member. The sleeve has a groove along the circumferential direction on its outer periphery and a lateral hole opening at one end to the groove and penetrating through the wall thickness of the sleeve. A clip member has an outer fitting portion, elastically deformable and fittable to the groove and has an inward convex portion holding the flange from the distal-end side of the sleeve, by being inserted in the lateral hole. The groove wall has a groove-depth wall at the deepest portion opposite to the groove opening and a distal-proximal-end-side curved portion of the groove-depth wall connected to the distal-proximal-end side of the sleeve. The radius of curvature of the distal-end-side curved portion is larger than that of the proximal-end-side curved portion.
Public/Granted literature
- US20240219939A1 TEMPERATURE ADJUSTMENT DEVICE Public/Granted day:2024-07-04
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