Invention Grant
- Patent Title: Semiconductor structure and method for forming semiconductor structure
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Application No.: US17676293Application Date: 2022-02-21
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Publication No.: US12278107B2Publication Date: 2025-04-15
- Inventor: Kai Cao
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN202110289168.9 20210318
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/311 ; H01L21/768

Abstract:
A semiconductor structure and a method for forming a semiconductor structure are provided. The method for forming the semiconductor structure includes: providing a base; forming a first dielectric layer on the base; then forming a plurality of first mask patterns each having zigzag shape on the first dielectric layer, in which the first mask patterns extend in a first direction; forming a plurality of second mask patterns each having zigzag shape on the first mask patterns, in which the second mask patterns extend in a second direction different from the first direction, and projections of the first mask patterns on the first dielectric layer and projections of the second mask patterns on the first dielectric layer overlap with each other to form polygons; and etching the first dielectric layer by using the second mask patterns and the first mask patterns as masks to form openings.
Public/Granted literature
- US20220301871A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE Public/Granted day:2022-09-22
Information query
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