A chip cooler with high pressure bearing capacity installed on a chip it cools. The chip cooler has a cooler body having a refrigerant channel formed corresponding to the internal construction of the cooler body and configured to guide the flow of a refrigerant, and two liquid inlet and outlet channels formed corresponding to the construction at an edge of the cooler body, connected to the refrigerant channel and configured to transversely communicate the inside and outside of the cooler body; and a reinforced connecting piece is disposed in at least one of the two liquid inlet and outlet channels, the reinforced connecting piece at least connects opposite upper and lower wall surfaces of the liquid inlet and outlet channel, and a flow gap exists between the reinforced connecting piece and the liquid inlet and outlet channel.