Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method including processing liquid supply unit
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Application No.: US17520588Application Date: 2021-11-05
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Publication No.: US12278118B2Publication Date: 2025-04-15
- Inventor: Seung Tae Yang , Jong Han Kim , Do Gyeong Ha
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR10-2020-0171186 20201209
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02
Abstract:
A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.
Public/Granted literature
- US20220181169A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD INCLUDING PROCESSING LIQUID SUPPLY UNIT Public/Granted day:2022-06-09
Information query
IPC分类:
