Invention Grant
- Patent Title: Semiconductor structure and fabrication method
-
Application No.: US17739913Application Date: 2022-05-09
-
Publication No.: US12278148B2Publication Date: 2025-04-15
- Inventor: Zhen Yu Liu
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201810663579.8 20180625
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/417

Abstract:
Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate having a first region and a second region. A surface of the first region of the semiconductor substrate contains a gate structure, a surface of the second region of the semiconductor substrate contains a dummy gate structure, and the semiconductor substrate under the dummy gate structure contains an isolation structure. The semiconductor structure further includes a bulk layer having a substantially flat reshaped surface formed in the semiconductor substrate at each of two sides of the gate structure; and a protective layer formed on the reshaped surface of the bulk layer.
Public/Granted literature
- US20220262686A1 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD Public/Granted day:2022-08-18
Information query
IPC分类: