Invention Grant
- Patent Title: Semiconductor package with conductive adhesive that overflows for return path reduction and associated method
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Application No.: US17832721Application Date: 2022-06-06
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Publication No.: US12278206B2Publication Date: 2025-04-15
- Inventor: Chun-Wei Chen , Yan-Bin Luo , Ming-Yin Ko
- Applicant: Airoha Technology (HK) Limited
- Applicant Address: HK North Point
- Assignee: Airoha Technology (HK) Limited
- Current Assignee: Airoha Technology (HK) Limited
- Current Assignee Address: HK North Point
- Agent Winston Hsu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.
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Information query
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