Invention Grant
- Patent Title: High voltage isolation devices for semiconductor devices
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Application No.: US18406827Application Date: 2024-01-08
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Publication No.: US12278286B2Publication Date: 2025-04-15
- Inventor: Michael A. Smith
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10

Abstract:
High voltage isolation devices for semiconductor devices and associated systems, are disclosed herein. The isolation device may support operations of a 3-dimensional NAND memory array of the semiconductor device. In some embodiments, during high voltage operations (e.g., erase operations), the isolation device may provide a high voltage to the memory array while isolating other circuitry supporting low voltage operations of the memory array from the high voltage. The isolation device may include a set of narrow active areas separating the low voltage circuitry from the high voltage and a gate over the narrow active areas. In a further embodiment, the isolation device includes interdigitated narrow active areas and a common gate over the interdigitated narrow active areas to reduce an area occupied by the isolation devices.
Public/Granted literature
- US20240154033A1 HIGH VOLTAGE ISOLATION DEVICES FOR SEMICONDUCTOR DEVICES Public/Granted day:2024-05-09
Information query
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