- Patent Title: High-frequency line structure with lead pin-connected substrates
-
Application No.: US17772446Application Date: 2019-10-29
-
Publication No.: US12278413B2Publication Date: 2025-04-15
- Inventor: Hiromasa Tanobe , Josuke Ozaki
- Applicant: Nippon Telegraph and Telephone Corporation
- Applicant Address: JP Tokyo
- Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- International Application: PCT/JP2019/042293 WO 20191029
- International Announcement: WO2021/084601 WO 20210506
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P1/04 ; H01P3/08 ; H01P11/00 ; H05K1/02 ; H05K3/22 ; H05K3/34
Abstract:
A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.
Public/Granted literature
- US20220384928A1 High-Frequency Line Connecting Structure Public/Granted day:2022-12-01
Information query
