Invention Grant
- Patent Title: Method for producing singulated encapsulated components
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Application No.: US17781977Application Date: 2019-12-19
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Publication No.: US12283491B2Publication Date: 2025-04-22
- Inventor: Gerald Mittendorfer , Friedrich Paul Lindner
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: RENNER, OTTO, BOISSELLE & SKLAR, LLP
- International Application: PCT/EP2019/086421 WO 20191219
- International Announcement: WO2021/121608 WO 20210624
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L21/78
Abstract:
A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.
Public/Granted literature
- US20230015545A1 METHOD FOR PRODUCING SINGULATED ENCAPSULATED COMPONENTS Public/Granted day:2023-01-19
Information query
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