A multi-zone heater capable of heating a wafer mounted on a disc-shaped ceramic substrate includes: a plurality of lift pin holes which are provided in the substrate; an inner zone heater embedded in an inner zone of the ceramic substrate; an outer zone heater embedded in an outer zone outside the inner zone; first and second feed terminals to which opposite ends of the inner zone heater are connected; first and second leads to which opposite ends of the outer zone heater are connected; and third and fourth feed terminals to which the first and second leads are respectively connected, the plurality of lift pin holes, the inner zone heater, and the outer zone heater are arranged to be symmetric with respect to a common axis of symmetry, and the first and second leads are arranged along the axis of symmetry to be symmetric to each other.