Invention Grant
- Patent Title: Humidity control device for equipment front end module of semiconductor processing or characterization tool
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Application No.: US17679223Application Date: 2022-02-24
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Publication No.: US12283506B2Publication Date: 2025-04-22
- Inventor: Ren-Hau Wu , Cheng-Kang Hu , Yi-Fam Shiu , Cheng-Lung Wu , Hsu-Shui Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Lippes Mathias LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/677

Abstract:
A load port receives a wafer carrier. An equipment front end module (EFEM) transfers semiconductor wafers to and from the wafer carrier via an access opening of a housing of the EFEM, and also transfers wafers to and from a semiconductor processing or characterization tool. A gas flow device disposed inside the housing of the EFEM is connected to receive a low humidity gas having relative humidity of 10% or less, and is positioned to flow the received low humidity gas across the access opening. A saturated pressure layer of the gas flow device has a permeability for the low humidity gas that increases with increasing distance from a gas inlet edge of the saturated pressure layer, for example due to holes of varying diameter and/or density passing through the saturated pressure layer. A filter layer of the gas flow device uniformizes the gas exiting the saturated pressure layer.
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